ADHESIVE TAPE FOR SEMICONDUCTOR WAFER PROCESSING AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: An adhesive tape for processing a semiconductor wafer and a method for fabricating the same are provided to prevent the warpage of the semiconductor wafer. CONSTITUTION: An adhesive tape includes a first hard resin layer(1) and a second hard resin layer(2). A warpage prevention layer(3) is formed between the second hard resin layer and an adhesive layer(4). The thickness of the warpage prevention layer is formed to be equal to or two times thicker than the thickness of the first hard resin layer. The thickness of the warpage prevention layer is 0.4-8 μm. The composition of the warpage prevention layer is the same composition as the first hard resin layer.