发明名称 METHOD OF FABRICATING METAL CONTACT STRUCTURE OF SEMICONDUCTOR LASER BY USING BACKSIDE UV RADIATION
摘要 <P>PROBLEM TO BE SOLVED: To remove alignment errors in a metal contact structure of a semiconductor laser. <P>SOLUTION: Provided is a method of fabricating a metal contact structure of a semiconductor laser. The method includes: a step of providing a UV-transmissible semiconductor substrate, a UV-transmissible semiconductor epitaxial layer demarcating a ridge arranged between epitaxial layer edges formed by etching and being arranged so as to cover the UV-transmissible semiconductor substrate, and a UV-untransmissible metal layer arranged so as to cover the epitaxial layer ridge; a step of applying at least one photoresist layer (a positive type photoresist, an image inverted photoresist, or a negative type photoresist) so as to cover the untransmissible metal layer and the epitaxial layer edges; and a step of selectively developing a region of the photoresist layer by backside radiation with UV light together with the untransmissible metal layer used as a photolithography mask. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077853(A) 申请公布日期 2013.04.25
申请号 JP20130016597 申请日期 2013.01.31
申请人 CORNING INC 发明人 ZAU CHUNG-AN;XI JINGQUN
分类号 H01S5/042 主分类号 H01S5/042
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