| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etchant that has reduced bubbling property in use and can highly selectively etch copper or a cooper alloy in a step of etching copper or a cooper alloy from an electronic substrate that simultaneously has copper or a cooper alloy and nickel. <P>SOLUTION: The etchant is used for the step of selectively etching copper or a cooper alloy from the electronic substrate that simultaneously has copper or a cooper alloy and nickel, wherein an etchant for copper or a cooper alloy including, as essential components, (A) a chain alkanolamine, (B) a chelating agent containing acid groups in the molecule and (C) a hydrogen peroxide is used. <P>COPYRIGHT: (C)2013,JPO&INPIT |
