| 摘要 |
PURPOSE: A method for analyzing the defect of a semiconductor wafer is provided to improve product quality by classifying noises instead of defects and accurately calculating the defects. CONSTITUTION: A difference image is generated(S10). The pixel value of the center coordinate is replaced with the smallest value among adjacent coordinate pixel values(S20). A recalculation image is generated by using the pixel value as a recalculated value(S30). The pixel value of the recalculation image is computed to determine a threshold(Tc)(S40). A defect is calculated by using a threshold value calculated by the pixel value of the recalculation image(S50). [Reference numerals] (S10) Step of generating a difference image; (S20) Step of replacing a pixel value of a center coordinate with the smallest value among adjacent coordinate pixel values; (S30) Step of generating a recalculation image; (S40) Step of determining a threshold value(T_c); (S50) Step of determining a defect |
