发明名称 |
METHOD OF CUTTING AN INGOT FOR SOLAR CELL FABRICATION |
摘要 |
<p>Methods of cutting ingots for solar cell fabrication, as well ingots and grippers there for, are described. In an example, a method of cutting an ingot includes gripping a portion of the ingot directly with a gripper of a cutting apparatus. The ingot is partially cut to form a plurality of wafer portions projecting from an uncut portion of the ingot. The ingot is further cut to separate the plurality of wafer portions from the uncut portion, to provide a plurality of discrete wafers.</p> |
申请公布号 |
WO2013141914(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
WO2012US70182 |
申请日期 |
2012.12.17 |
申请人 |
SUNPOWER CORPORATION |
发明人 |
SUN, SHENG;BOYON, FERNANDO;LEGASPI, ROY JOSEPH;DAWSON, MATTHEW;STONE, CHARLES |
分类号 |
H01L21/301;H01L31/042 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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