| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method which can restrain all of damage to boards, residuals of solder balls, and poor fillet formation even when electronic elements are mounted on a printed wiring board built with a low melting point board such as a PET or PEN by irradiating it with near-infrared laser light from the reverse side of the board.SOLUTION: An electronic component manufacturing method of the present invention involves mounting electronic elements on a printed wiring board built with a board made of resin whose melting point is 280°C or less and having a wiring pattern thereon. The manufacturing method includes a step of supplying solder, a placement step of placing terminals for the electronic elements into position, and a step of soldering the electronic elements to the printed wiring board by irradiating it with near-infrared laser light. In the placement step, the wiring pattern is restricted in width to 2 mm or less within at least 2 mm on both sides in the extension direction of the wiring pattern from the center in width of the terminal, and the shortest distance from an end portion in the width direction on one side of the wiring pattern to the terminal is defined to be 0.5 mm to 1.6 mm. |
