发明名称 LIQUID RESIN MOLDING APPARATUS
摘要 In a liquid resin molding apparatus including a mold, an injection machine, a metering/supplying mechanism for metering a liquid resin material and supplying a metered amount of liquid resin material to the injection machine, and a pump for pressure-feeding the liquid resin material to the metering/supplying mechanism, the pump is a piston pump having a piston and an actuator for reciprocating the piston, and a discharge pressure of the piston pump is set to be at least 1.5 times a supply pressure with which the liquid resin material is supplied to the metering/supplying mechanism. A pressure reducing valve is disposed in a supply path extending from the piston pump to the metering/supplying mechanism, so as to reduce a pressure of the liquid resin material from the discharge pressure to the supply pressure.
申请公布号 US2014134286(A1) 申请公布日期 2014.05.15
申请号 US201314079141 申请日期 2013.11.13
申请人 NISSEI PLASTIC INDUSTRIAL CO., LTD. 发明人 IKEDA TORU
分类号 B29C45/18 主分类号 B29C45/18
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