| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a division method and a division device of a wafer capable of suppressing the cracking of a chip when a dicing tape is gripped by a grip ring.SOLUTION: A division method of a wafer is a method for dividing a wafer, having a modified layer for cleavage formed thereon, and fixing the wafer thus divided to a grip ring composed of an inner ring and an outer ring. First, a dicing frame where a wafer is mounted by means of a dicing tape is fixed, the wafer is extruded by means of an extrusion member for holding the inner ring from the surface of the dicing tape on the side opposite from the surface where the wafer is stuck, and then the wafer is cleaved by extending the dicing tape. Thereafter, the dicing tape is pressed against the inner ring and, in a state where elongation of the dicing tape located in the inner area of the inner ring is suppressed, the outer ring and inner ring are fitted and fixed.</p> |
