发明名称 JIG FOR LAMINATING COVERLAY FILM
摘要 <p>The present invention relates to a jig for bonding a reinforcement material and, more particularly, to a jig for bonding a reinforcement material capable of guiding an adhesion between the reinforcement material and a printed circuit board. The jig for bonding the reinforcement material according to an embodiment of the present invention includes a fixing frame, one or more receiving protrusions, a receiving frame which is fixed and combined with the receiving protrusion and has a second through hole which is vertically formed and is connected to a first through hole of the receiving protrusion, a fixing pin which fixes the reinforcement material on the printed circuit board, a base frame which is fixed and combined with the fixing pin, a first elastic member which selectively separates the fixing frame and the receiving frame, and a second elastic member which selectively separates the receiving frame and the base frame.</p>
申请公布号 KR101486659(B1) 申请公布日期 2015.01.29
申请号 KR20130111119 申请日期 2013.09.16
申请人 发明人
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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