Thermally adaptive in-system allocation

摘要

An integrated circuit device includes component devices (that include primary and alternate devices) and storage elements connected to the component devices. The storage elements store different sets of repair addresses indicating which of the primary devices and alternate devices are to be enabled. Further, a controller is connected to the storage elements, and a temperature sensor is connected to the controller. The temperature sensor senses the temperature. The controller selects one of the different storage elements to select at least one of the sets of repair addresses based on the temperature sensed by the temperature sensor. The sets of repair addresses share use of at least one of the alternate devices and at least one of the primary devices.

主权项

1. An integrated circuit device comprising:
component devices, said component devices comprising primary devices and alternate devices; a controller operatively connected to said component devices; storage elements operatively connected to said controller, said storage elements storing different sets of repair addresses indicating which of said primary devices and alternate devices are to be enabled; and a temperature sensor operatively connected to said controller, said temperature sensor sensing a temperature of said integrated circuit device, said controller selecting different ones of said storage elements to select at least one of said different sets of repair addresses based on said temperature sensed by said temperature sensor, and said different sets of repair addresses sharing use of at least one of said alternate devices and at least one of said primary devices.