| 摘要 |
The purpose of the present invention is to provide a resin composition for a film, with which excellent insulating properties and heat resistance are attained, and which can maintain adhesive strength despite being filled with an insulating filler, and in particular a resin composition for a film with which adhesive strength can be maintained despite being highly filled with a highly heat conductive filler. This resin composition for a film is characterized by including (A) a polyether compound having at both terminals thereof a phenyl group to which a specific vinyl group is bonded, (B) a thermoplastic elastomer, (C) a naphthalene type epoxy resin, (D) a curing agent, and (E) an insulating filler, component (C) being included at a level of 0.5-30.0 mass parts to a total of 100 mass parts of component (A), component (B), component (C), and component (D). |
