| 发明名称 |
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION |
| 摘要 |
An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles. |
| 申请公布号 |
US2015179478(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201314135236 |
申请日期 |
2013.12.19 |
| 申请人 |
Xiu Yonghao;Ananthakrishnan Nisha;Bai Yiqun;Krishnan Arjun |
发明人 |
Xiu Yonghao;Ananthakrishnan Nisha;Bai Yiqun;Krishnan Arjun |
| 分类号 |
H01L21/56;H01L23/29;H01L23/00 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An underfill composition comprising:
a curable resin; a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition, the filler particles comprising:
first filler particles having a particle size of from 0.1 micrometers to 15 micrometers; andsecond filler particles having a particle size of less than 100 nanometers;wherein a viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles. |
| 地址 |
Chandler AZ US |
