RESIN COMPOSITION OF SEALING OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for sealing of electronic devices which can suppress permeation of moisture vapor sufficiently and an electronic device.SOLUTION: A resin composition for electronic devices contains (A) a polybutadiene polymer of formula (1) having a (meth)acryloyl group at the end and (B) a photopolymerization initiator and does not contain a thermoplastic resin of a mass average molecular weight of 50,000 or higher. In formula (1), R1 and R2 each are a hydroxy group or HC=C(R)-COO-; R3 and R4 are independently a 1-16C, optionally substituted divalent organic group; R5 to R7 are H, a 1-10C alkyl group or an organic group containing at least one amide(peptide) bond; l and m each are 0 or 1; n is 15-150; x:y=0-100:100-0; and R1 and R2 are not hydroxy groups at the same time.