| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin film forming apparatus capable of maintaining the temperature of a thin film material within an acceptable range and capable of suppressing excess temperature rise in a nozzle head of the apparatus.SOLUTION: The thin film forming apparatus comprises: a nozzle head which is provided with a plurality of nozzle holes, forms a liquid thin film material into a liquid droplet and ejects it toward a substrate; a supply mechanism which heats the thin film material and supplies it to the nozzle head; a movement mechanism which moves the substrate to the nozzle head in planar view; a cooling mechanism which cools the nozzle head; and a control device which controls ejection of the thin film material from the nozzle holes, a relative movement of the nozzle head with the substrate performed by the movement mechanism, and the start and stop of cooling performed by the cooling mechanism. On the basis of the time point when the nozzle head reaches the circumference of an applying target region from the outside thereof and at the time point when the nozzle head reaches that circumference after coming across the inside of the applying target region, in planar view, the control device controls the timing of start and stop of cooling performed by the cooling mechanism.</p> |
