发明名称 JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME
摘要 The jointed structure of the present invention is configured such that a first metal layer and a second metal layer are jointed together. More specifically, the jointed structure of the present invention includes: the first metal layer which receives heat from a heat generating body; and the second metal layer which is jointed to the first metal layer and receives heat from the first metal layer, for example. The first metal layer and the second metal layer according to the present invention are jointed together by solid-phase joining via a joining interface microstructure that has a thickness of 50 nm or less. Since the first metal surface and the second metal surface are jointed together without via a brazing material, adhesive or other material, the jointed structure of the present invention exhibits high conductivity and heat resistance property. Such a jointed structure is suitable for power modules.
申请公布号 US2015270238(A1) 申请公布日期 2015.09.24
申请号 US201514618269 申请日期 2015.02.10
申请人 KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO 发明人 OSHIMA Tadashi;ITO Hirofumi;TAKAO Hisaaki
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A jointed structure comprising a first metal layer and a second metal layer, the first metal layer and the second metal layer being jointed together and having different coefficients of thermal expansion, the first metal layer and the second metal layer being jointed together by solid-phase joining via a jointing interface microstructure, the jointing interface microstructure having a thickness of 50 nm or less.
地址 Nagakute-shi JP