THREE DIMENSIONAL INTEGRATED CIRCUIT AND METHOD FOR CONTROLLING THE SAME

摘要

A three dimensional integrated circuit includes a master circuit, a slave circuit, and a through-silicon via (TSV). The master circuit is configured to receive and process an input data, a data strobe signal (DQS) and an input command to output a writing data signal to a master die. The through-silicon via (TSV) is electrically coupled between the master circuit and the slave circuit. The master circuit is configured to transfer the writing data signal to a slave die through the TSV. Furthermore, a method for controlling a three dimensional integrated circuit is disclosed herein.

主权项

1. A three dimensional integrated circuit, comprising:
a master circuit configured to receive and process an input data, a data strobe signal (DOS) and an input command to output a writing data signal to a master die; a slave circuit; and a through-silicon via (TSV) electrically coupled between the master circuit and the slave circuit; wherein the master circuit is configured to transfer the writing data signal to a slave die through the TSV.