发明名称 |
Three-dimensional molding equipment |
摘要 |
Three-dimensional molding equipment includes powder supply equipment configured to supply powder material and form a powder layer, and a light beam scanning unit configured to radiate a light beam to the powder layer and move a radiated location thereof, where a three-dimensional shaped molding object is manufactured by alternately repeating processes of forming the powder layer and sintering the powder layer with light beam radiation. A region used for manufacturing the three-dimensional shaped molding object is divided into a plurality of divided regions such that respective divided regions have an equal-length molding path which is to be a scanning route of the beam such as having unequal-length molding parts by a scanning route of the beam, and radiation is executed by a plurality of the light beam scanning units to the respective plurality of divided regions to improve molding efficiency. |
申请公布号 |
US9138807(B1) |
申请公布日期 |
2015.09.22 |
申请号 |
US201414518178 |
申请日期 |
2014.10.20 |
申请人 |
Matsuura Machinery Corporation |
发明人 |
Takezawa Yasunori;Maeda Toshio;Kato Toshihiko;Amaya Koichi |
分类号 |
B29C59/16;B22F3/105;B28B1/00;B28B17/00;B33Y30/00;B33Y50/02 |
主分类号 |
B29C59/16 |
代理机构 |
|
代理人 |
Goldberg Richard M. |
主权项 |
1. Three-dimensional molding equipment comprising:
a powder supply equipment which includes a laminating device to form a powder layer; a plurality of beam scanning units, each of which uses one of a light beam and an electron beam, and a control unit which:
divides a region used for manufacturing a three-dimensional shaped molding object into a plurality of divided regions,controls said beam scanning units on a one-to-one-basis in a sintering process to radiate said one of a light beam and an electron beam to the powder layer,simultaneously moves a radiated location of each one of the light beam and the electron beam to sinter the powder layer in a laminating process to a corresponding one of the respective divided regions,alternately repeats the laminating process and the sintering process,forms the divided regions such that respective ones of the divided regions have an equal-length molding path which is to be a scanning route of the respective one of the light beam and the electron beam and such that the molding path includes both:
a raster molding path for scanning an inner region anda vector molding path for scanning a region to be molded along a contour region. |
地址 |
Fukui, Fukui JP |