Light emitting device, display device, and manufacturing method for light emitting device

摘要

A light emitting device in which a plurality of LED chips are arranged. Each of the plurality of LED chips include a light emitting region that is formed on a substrate, a first pad electrode that is formed on the substrate, and a through-hole that penetrates the substrate. First wiring that passes through the through-hole of one LED chip and the through-hole of an adjacent LED chip, and electrically connects the first pad electrode of the one LED chip and the first pad electrode of the adjacent LED chip is provided. The tip-end parts of the first wiring that have passed through the through-holes have, at a cross section cut at a plane that is parallel with a principal surface of the substrate, a larger cross-sectional area than the cross-sectional area of the first wiring inside the through-holes.

主权项

1. A light emitting device comprising:
a plurality of LED chips comprising a first LED chip and a second LED chip, each of the plurality of LED chips comprising: a substrate; a light emitting region that is formed on the substrate; an electrode that is connected to the light emitting region and is formed on the substrate; one or more through-holes that penetrate the substrate; and one or more wirings, each passing through the one or more through-holes of the first LED chip and the one or more through-holes of the second LED chip that is adjacent to the first LED chip, and that electrically connecting the electrode of the first LED chip and the electrode of the second LED chip,wherein
with regard to each of the first LED chip and the second LED chip, a tip-end part of each of the one or more wirings passing through the one or more through-holes has, at a cross section when cut at a plane that is parallel with a first principle surface of the substrate, a larger cross-sectional area than a cross-sectional area of each of the one or more wirings inside the one or more through-holes, the substrate of the first LED chip and the substrate of the second LED chip are separated, and the each of the one or more wirings links the first LED chip and the second LED chip.