发明名称 Systems and processes for forming molds such as nickel molds
摘要 For forming a nickel mold, a metal and a corresponding etchant are selected such that the etchant selectively etches the metal over nickel. The metal is sputtered onto a surface of a template having nano-structures to form a sacrificial layer covering the nano-structures. Nickel is electroplated onto the sacrificial layer to form a nickel mold, but leaving a portion of the sacrificial layer exposed. The sacrificial layer is contacted with the etchant through the exposed portion of the sacrificial layer to etch away the sacrificial layer until the nickel mold is separated from the template. Subsequently, the nickel mold may be replicated or scaled-up to produce a replicate mold by electroplating, where the replicate mold has nano-structures that match the nano-structures on the template. The metal may be copper.
申请公布号 US9139924(B2) 申请公布日期 2015.09.22
申请号 US201213593272 申请日期 2012.08.23
申请人 Agency for Science, Technology and Research 发明人 Ansari Kambiz;Tan Christina Yuan Ling;Loke Yee Chong;Dumond Jarrett;Rodriguez Isabel
分类号 C25D1/10;C25D1/00;C23C14/04;C23C14/20;C23C14/58 主分类号 C25D1/10
代理机构 Wolf, Greenfield & Sacks, P.C. 代理人 Wolf, Greenfield & Sacks, P.C.
主权项 1. A method comprising: selecting a metal and a corresponding etchant such that said etchant selectively etches said metal over nickel; sputtering said metal onto a surface of a template having nano-structures to form a sacrificial layer covering said nano-structures; electroplating nickel onto said sacrificial layer to form a nickel mold, leaving a portion of said sacrificial layer exposed; and contacting said sacrificial layer with said etchant through said exposed portion of said sacrificial layer to etch away said sacrificial layer until said nickel mold is separated from said template, said nickel mold having a front side having nano-structures and a back side opposite said front side; and replicating said nickel mold by electroplating to produce a replicate mold having nano-structures that match said nano-structures on said template, wherein said replicating comprises: placing said nickel mold in an opening of a metal base sized to receive said nickel mold, wherein a conductive film is sandwiched between said nickel mold and said metal base; andelectroplating nickel onto said nickel mold and said metal base to form said replicate mold, wherein said replicate mold is larger than said nickel mold.
地址 Singapore SG