| 摘要 |
The method prevents the damage of internal circuit and the discoloring of pad in the wafer-chip cutting. The method comprises various processes such as taping for attaching tape on the wafer backside after mounting the wafer on chuck; sawing for using D.I water for the blade cooling, separating die on the wafer by the blade rotation; high-pressure water cleaning for removing the silicon dust attached on the die pad in sawing. The die is separated from wafer by the blade rotation, while maintaining the constant-pressure of D.I water contained water soluble gas (CO2) and the constant-cutting speed of the blade.
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