发明名称 TRANSMISSION LINE INTERCONNECT
摘要 One example discloses a transmission line interconnect, comprising: an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface. Another example discloses a method of manufacture, for a transmission line interconnect, comprising: forming a dielectric molding compound; defining an antenna coupling surface on the dielectric molding compound; and defining a transmission line coupling surface on the dielectric molding compound whereby millimeter wave frequencies received at the antenna coupling surface are electromagnetically coupled to the transmission line coupling surface.
申请公布号 US2015263403(A1) 申请公布日期 2015.09.17
申请号 US201414205029 申请日期 2014.03.11
申请人 NXP B.V. 发明人 Spella Maristella;Roovers Raf Lodewijk Jan
分类号 H01P5/08;H01Q1/50;H01P11/00 主分类号 H01P5/08
代理机构 代理人
主权项 1. A transmission line interconnect, comprising: an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface.
地址 Eindhoven NL