发明名称 |
TRANSMISSION LINE INTERCONNECT |
摘要 |
One example discloses a transmission line interconnect, comprising: an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface. Another example discloses a method of manufacture, for a transmission line interconnect, comprising: forming a dielectric molding compound; defining an antenna coupling surface on the dielectric molding compound; and defining a transmission line coupling surface on the dielectric molding compound whereby millimeter wave frequencies received at the antenna coupling surface are electromagnetically coupled to the transmission line coupling surface. |
申请公布号 |
US2015263403(A1) |
申请公布日期 |
2015.09.17 |
申请号 |
US201414205029 |
申请日期 |
2014.03.11 |
申请人 |
NXP B.V. |
发明人 |
Spella Maristella;Roovers Raf Lodewijk Jan |
分类号 |
H01P5/08;H01Q1/50;H01P11/00 |
主分类号 |
H01P5/08 |
代理机构 |
|
代理人 |
|
主权项 |
1. A transmission line interconnect, comprising:
an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface. |
地址 |
Eindhoven NL |