A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad (100) has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer (120). The non-fibrous polishing layer (120) has a polishing surface with a pore count of at least 500 pores per mm<2> that decreases with removal of the polishing layer; and the polishing surface has a surface roughness Ra between 0.01 and 3 mu m. <IMAGE>
申请公布号
EP1502703(B1)
申请公布日期
2015.09.16
申请号
EP20040254465
申请日期
2004.07.27
申请人
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
发明人
FAWCETT, CLYDE A.;CRKVENAC, T. TODD;PRYGON, KENNETH A.;FOSTER, BERNARD