发明名称 Method of forming a magnetic tunnel junction structure
摘要 In a particular embodiment, a method is disclosed that includes forming a magnetic tunnel junction (MTJ) structure including a conductive layer on a substrate. The method also includes depositing a sacrificial layer on the conductive layer before depositing a patterning film layer.
申请公布号 US9136463(B2) 申请公布日期 2015.09.15
申请号 US200711943042 申请日期 2007.11.20
申请人 QUALCOMM Incorporated 发明人 Li Xia;Kang Seung H.;Zhu Xiaochun
分类号 H01L21/00;H01L43/12 主分类号 H01L21/00
代理机构 代理人 Min Donald D.
主权项 1. A method comprising: forming a magnetic tunnel junction (MTJ) structure including a conductive layer on a substrate; depositing a sacrificial layer on the conductive layer, the sacrificial layer comprising silicon carbon; depositing an amorphous carbon layer on the sacrificial layer, the sacrificial layer selected to have a chemical structure having substantially no impact on a resolution of a pattern definition with respect to the amorphous carbon layer; depositing one or more hard mask and photo-resist layers on the amorphous carbon layer deposited on the sacrificial layer, the amorphous carbon layer located between the sacrificial layer and the one or more hard mask and photo-resist layers; patterning and removing the one or more hard mask and photo-resist layers and the amorphous carbon layer; and depositing a non-magnetic spacer film on an exposed portion of the sacrificial layer, wherein the sacrificial layer is comprised of the same material as the non-magnetic spacer film.
地址 San Diego CA US