| 发明名称 |
Semiconductor device manufacturing method |
| 摘要 |
A method of manufacturing a semiconductor device, includes the steps of passing a control terminal through an opening of a resin case to partially expose the control terminal and covering a patterned insulating substrate with the resin case; inserting a resin block in the opening of the resin case; fitting a convex step portion formed on a side surface of the resin block into a valley formed between two projections of the control terminal; fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case; and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal. |
| 申请公布号 |
US9136225(B2) |
申请公布日期 |
2015.09.15 |
| 申请号 |
US201514703313 |
申请日期 |
2015.05.04 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
Kodaira Yoshihiro |
| 分类号 |
H01L23/544;H01L23/31;H01L23/14;H01L23/29;H01L21/56;H01L29/66;H01L23/34;H01L23/10;H01L23/498;H01L23/053;H01L23/36 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
Kanesaka Manabu |
| 主权项 |
1. A method of manufacturing a semiconductor device including a control terminal attached to a patterned insulating substrate, and a resin case disposed to cover the patterned insulating substrate and having an opening for passing the control terminal therethrough, the method comprising the steps of:
passing the control terminal through the opening of the resin case to partially expose the control terminal from the opening and covering the patterned insulating substrate with the resin case; and inserting a resin block in the opening of the resin case, fitting a convex step portion formed on a side surface of the resin block into a concave portion formed between two projections of the control terminal, fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case, and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal. |
| 地址 |
Kawasaki-Shi JP |
