Microelectronic package having wire bond vias and stiffening layer

摘要

Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.

主权项

1. A microelectronic package comprising:
a component having a surface and a plurality of conductive elements at the surface; a plurality of wire bonds having first ends joined to the conductive elements and second ends remote from the first ends, the wire bonds having lengths between their respective first and second ends; a dielectric stiffening layer overlying the conductive elements and the surface, and covering a first portion of the length of each of the wire bonds; and an encapsulation layer overlying the dielectric stiffening layer, in which the dielectric stiffening layer is stiffer and other than the encapsulation layer, above the surface of the component and covering a second portion of the length of each of the wire bonds, wherein second ends of the wire bonds are at least partially uncovered by the encapsulation layer at a surface of the encapsulation layer above the dielectric stiffening layer and remote from the dielectric stiffening layer.