Stacked LED for optical sensor devices

摘要

An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.

主权项

1. A wafer level optical device, comprising:
a substrate; a sensor disposed on the substrate; a molding layer disposed over the sensor; a lens formed on the molding layer; and a light-emitting diode package disposed on the substrate, where the light-emitting diode package at least partially covers the sensor and the molding layer, the light-emitting diode package including
at least one 3D substrate,a light-emitting diode substrate,a light-emitting diode disposed on the light-emitting diode substrate, anda light-emitting diode lens disposed on the light-emitting diode.