发明名称 PATTERN FORMING METHOD AND PATTERNED SUBSTRATE MANUFACTURING METHOD
摘要 [Problem] To form a pattern of recesses and projections at a low cost and high yield while suppressing the occurrence of defects. [Solution] A nanoimprint mold (1) is used that includes, on the surface thereof, a main pattern area (2) that is obtained by forming a pattern of recesses and projections to be transferred, and a non-main pattern area (3) that is adjacent to the main pattern area (2) and is a flat surface or a dummy pattern having a pattern density or aspect ratio smaller than said pattern of recesses and projections. As resist liquids, a plurality of resist liquids (12, 13) having different components and different mold release capabilities after curing are prepared. At a coating step, the resist liquid (12) with the relatively lower mold release capability after curing is applied to an area on the surface of a nanoimprint substrate (10) corresponding to the main pattern area (2), and the resist liquid (13) with the relatively higher mold release capability after curing is applied to at least part of an area on the surface of the nanoimprint substrate corresponding to the non-main pattern area (3).
申请公布号 WO2015133102(A1) 申请公布日期 2015.09.11
申请号 WO2015JP01023 申请日期 2015.02.27
申请人 FUJIFILM CORPORATION 发明人 OHTSU, AKIHIKO;GOTO, YUICHIRO
分类号 H01L21/027;B29C59/02 主分类号 H01L21/027
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