Jet impingement cooling apparatuses having enhanced heat transfer assemblies

摘要

Enhanced heat transfer assemblies and jet impingement cooling apparatuses having target surfaces with surface fins and microslots are disclosed. In one embodiment, an enhanced heat transfer assembly includes a target surface, a plurality of surface fins extending from the target surface, and a plurality of microslot matrices formed on the target surface. Each microslot matrix includes individual microslots positioned adjacent to each other, and each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins. Jet impingement cooling apparatuses and power electronics modules having an enhanced heat transfer assembly with surface fins and matrices of microslots are also disclosed.

主权项

1. An enhanced heat transfer assembly comprising:
a target surface; a plurality of surface fins extending from the target surface; and a plurality of microslot matrices formed on the target surface wherein:
each microslot matrix comprises individual microslots positioned adjacent to each other, andeach microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins.