发明名称 PARTIAL PLATING METHOD AND PARTIAL PLATING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To apply partial plating to only a desired part of a belt-like object to be processed surely and continuously.SOLUTION: A partial plating device 10 comprises: a transport part 40 for moving a belt-like object to be processed in a longitudinal direction; a plating liquid supply cell 22 and plating liquid collection cell 32 disposed so as to face each other while sandwiching a movement path of the object to be processed; and a supply side slit 26 and a collection side slit 36 disposed so as to be parallel with the movement direction of the object to be processed. Pressure in the plating liquid collection cell 32 is made sufficiently lower than atmospheric pressure, so that the plating liquid flown from the supply side slit 26 by a low flow rate is hardly dispersed on a rear face of the object to be processed, and forcibly sucked in the collection side slit 36. Accordingly, plating can be applied to only a target part among surfaces of front face and rear face of the object to be processed and wall faces connecting them, and plating to other parts is suppressed to minimum.</p>
申请公布号 JP2015157984(A) 申请公布日期 2015.09.03
申请号 JP20140033218 申请日期 2014.02.24
申请人 UEDA PLATING CO LTD 发明人 OGASA HIROYUKI;TANIGUCHI TOMIO;TODA TOSHIYUKI
分类号 C25D5/02 主分类号 C25D5/02
代理机构 代理人
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