| 摘要 |
<p>A method and apparatus for cutting edible wafer books comprises feeding a first wafer book into a first cutting station 6, extending a first cutting station pusher 10 a first time to push the first wafer book through a first cutter 12 into a second cutting station so as to cut the wafer books into a plurality of strips aligned in an axis of movement through the first cutter. Thereafter the first cutting station pusher is retracted a first time, a second wafer book fed into the first cutting station and the first cutting station pusher extended a second time to push the second wafer book through the first cutter into the second cutting station to a position adjacent the first wafer book, so as to cut the second wafer book into a plurality of first strips aligned in an axis of movement through the first cutter, and thereafter the first cutter station pusher retraced a second time, a second cutting station pusher 26 extended in a direction substantially perpendicular to the axis of movement through the first cutter to simultaneously push the first and second wafer books through a second cutter 28, said second cutter configured to cut the wafer books in a direction traverse to the first cuts so as to cut each of the first strips into a plurality of wafers.</p> |
