| 摘要 |
<p>Disclosed are a semiconductor package comprising a molding structure of a semiconductor chip, and a manufacturing method thereof. According to an embodiment of the present invention, the semiconductor package includes: a semiconductor chip; a wiring layer unit which is electrically connected to a signal pad of the semiconductor chip and extended to an external side of the semiconductor chip; a wiring unit comprising an insulating layer for insulating a wiring layer unit; an encapsulating material for molding the semiconductor layer and the wiring layer unit; an external connection terminal which is configured at an opposing face relative to a face where a semiconductor chip of the wiring unit is arranged, and electrically connected to the wiring layer; and a gusset plate having the higher intensity of the heat resistance than the encapsulating material by covering one side of the encapsulating material by being configured at an opposing side of the side where a wiring unit of the encapsulating material is arranged.</p> |
