Bonding alignment tool and method

摘要

An apparatus is disclosed for detecting flag velocity during a eutectic process for bonding two wafers. The apparatus includes a plurality of sensors for detecting a time and/or velocity of a plurality of flags within a flag-out mechanism. The apparatus also includes one or more displays displaying time durations associated with the movement of the flags during the bonding process. Also disclosed is a method of aligning wafers in a eutectic bonding process. The method includes determining one or more time durations associated with the movement of the flags in the plurality of flags. The method also includes determining if a misalignment has occurred based on the one or more time durations associated with the movement of the flags.

主权项

1. A method of aligning two wafers during a bonding process, the method comprising:
aligning a first wafer having a plurality of alignment markings with a second wafer having a plurality of alignment markings by aligning the plurality of alignment markings of the first wafer with corresponding markings of the plurality of alignment markings of the second wafer; placing a plurality of flags between the first wafer and the second wafer; clamping the first wafer and the second wafer together; detecting movement of the plurality of flags with respect to the first wafer and the second wafer using a plurality of sensors; and determining whether the wafers remain aligned within an alignment tolerance based on the detected movement of the plurality of flags with respect to the first wafer and the second wafer.