METHOD FOR IMPROVING THICKNESS OF CHEMICALLY PLATED NICKEL-PHOSPHORUS ALLOY LAYER VIA ELECTRIC PULSE

摘要

Provided is a method for improving the thickness of a chemically plated nickel-phosphorus alloy layer via electric pulse. The present invention relates to a method for improving the thickness of the chemically plated nickel-phosphorus alloy layer. The problem to be solved by the present invention is that in the existing process for chemical nickel-plating, the thickness of a plated layer is generally not greater than 100 microns. The method comprises: I. a pretreatment; and II. an electric pulse and nickel-plating treatment, thereby obtaining a plated part having an improved thickness of the chemically plated nickel-phosphorus alloy. The present invention enables the thickness of the chemically plated nickel-phosphorus alloy to reach not less than 200 microns, which is applicable to an occasion where the thickness of the chemically plated nickel-phosphorus alloy is required to be not less than 200 microns. The present invention is used for the method for improving the thickness of a chemically plated nickel-phosphorus alloy layer via electric pulse.