METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING MAGNETIC SHIELD UNIT

摘要

A method of manufacturing a semiconductor package having a magnetic shield function is provided. The method includes forming cracks in a lattice structure on an active surface in which electrode terminals are formed; grinding a back surface of a wafer facing the active surface, bonding a tape on the active surface of the wafer, expanding the tape such that the wafer on the tape is divided as semiconductor chips, forming a shield layer on surfaces of the semiconductor chips and the tape, cutting the shield layer between the semiconductor chips and individualizing as each of the semiconductor chips which has a first shield pattern formed on back surface and sides, bonding the semiconductor chips on a substrate, and forming a second shield pattern on each of the active surfaces of the semiconductor chips, wherein the semiconductor chips and the substrate are physically and electrically connected by a bonding wire.

主权项

1. A method of manufacturing a semiconductor package, comprising:
forming cracks in a lattice structure on an active surface of a wafer in which electrode terminals are formed; grinding a back surface of the wafer facing the active surface; bonding a tape on the active surface of the wafer; expanding the tape such that the wafer on the tape is divided into a plurality of sections, each section corresponding to a semiconductor chip; forming a shield layer on surfaces of the semiconductor chips and the tape; cutting the shield layer between the semiconductor chips, and sectioning off each of the semiconductor chips, each semiconductor chip having an active surface and a first shield pattern on a back surface and sides thereof; bonding the semiconductor chips to a substrate; and forming a second shield pattern on each active surface of the semiconductor chips, wherein the semiconductor chips and the substrate are connected by a bonding wire.