| 发明名称 |
JOINING MATERIAL |
| 摘要 |
A joining material includes a composite material including a first metal material having a thermal expansion coefficient of not more than 5, and a second metal material formed on the first metal material, the second metal material having a thermal expansion coefficient higher than the first metal material, and a solder material formed on the composite material. The solder material includes a lead-free solder having a melting point of not less than 260 degrees C., and a laminated structure configured such that a Zn based metal material including Zn as a main component, a first Al based metal material including Al as a main component, and a first X based metal material including Cu, Au, Ag or Sn as a main component are laminated in the order starting from the composite material. |
| 申请公布号 |
US2015239070(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414339643 |
申请日期 |
2014.07.24 |
| 申请人 |
Hitachi Metals, Ltd. |
发明人 |
Kuroki Kazuma;Oda Yuichi;Kuroda Hiromitsu |
| 分类号 |
B23K35/02;B23K35/26;B23K35/30;B23K35/00 |
主分类号 |
B23K35/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A joining material, comprising:
a composite material comprising a first metal material having a thermal expansion coefficient of not more than 5, and a second metal material formed on the first metal material, the second metal material having a thermal expansion coefficient higher than the first metal material; and a solder material formed on the composite material, wherein the solder material comprises a lead-free solder having a melting point of not less than 260 degrees C., and a laminated structure configured such that a Zn based metal material including Zn as a main component, a first Al based metal material including Al as a main component, and a first X based metal material including Cu, Au, Ag or Sn as a main component are laminated in the order starting from the composite material. |
| 地址 |
Tokyo JP |
