| 摘要 |
<p>A method of manufacturing a PCB according to an embodiment includes the steps of: preparing a main circuit board which includes at least one circuit pattern layer and an insulating layer which insulates the circuit pattern layer, and has a contact pad exposed by an uppermost insulating pattern; forming a metal post on a preliminary substrate; and bonding the metal post on the preliminary substrate to the contact pad on the main circuit board.</p> |
