Device for embossing of substrates

摘要

The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of:
at least one receiving means for holding the substrate in a working space,a calibration means located at least partially in the working space for calibration of the substrate,an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.

主权项

1. Device for applying and embossing a structure material on a substrate, especially semiconductor substrates or wafers, said device comprising:
side walls, a cover and a base plate defining an enclosed working space, at least one receiving means for holding the substrate in the working space, an application means which is located at least partially in the working space for application of the structure material to the substrate in an application process, said application means including at least one nozzle disposed in said working space and an actuator for moving said at least one nozzle in a direction generally perpendicular to said substrate wherein an actuator rod of said actuator extends through said cover of said device, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, and a calibration means located at least partially in the working space for selectively placing said receiving means proximate to said application means and said embossing means, wherein the enclosed working space of the device is exposed to a defined atmosphere before and during the embossing process, without interruption, wherein the defined atmosphere is different than an atmosphere outside of the enclosed working space.