| 摘要 |
PROBLEM TO BE SOLVED: To provide a package of power dies which can be simply achieved, and has good thermal transfer performance.SOLUTION: A package of power dies includes: a first part that includes a plaque on which dies are disposed, the plaque including first, second and third metallic plates disposed on an electrically insulating substrate, and an electrically insulting layer being disposed on a fourth metallic plate; and a second part that includes fifth and sixth metallic plates disposed on another electrically insulating substrate, the other electrically insulating layer being disposed on a seventh metallic plate. The fourth and seventh metallic plates are mechanically joined. The dies are divided into a first group of dies and a second group of dies, the first group of dies having an electric contact with the first, fifth and sixth metallic plates and the second group of dies being in contact with the second, third and sixth metallic plates. The first plate is a positive DC voltage connection, the second plate is a negative DC voltage connection, the third plate is a gate connection of the second group of dies, the fourth plate is an AC voltage connection, and the fifth plate is a gate connection of the first group of dies. |
