发明名称 |
USE OF CsOH IN DIELECTRIC CMP SLURRY |
摘要 |
PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing composition including an abrasive and cesium hydroxide, and a method for polishing a dielectric layer associated with an integrated circuit using cesium hydroxide containing a polishing composition.SOLUTION: A composition for chemical mechanical polishing composition comprises fumed abrasive grains and about 0.01 to about 5.0 wt.% of at least one Cs+ basic salt. Preferably, the composition for chemical mechanical polishing comprises water, about 1 to about 50 wt.% of fumed silica, and about 0.1 to 2.0 wt.% of CsOH. |
申请公布号 |
JP2015147938(A) |
申请公布日期 |
2015.08.20 |
申请号 |
JP20150094245 |
申请日期 |
2015.05.01 |
申请人 |
CABOT MICROELECTRONICS CORP |
发明人 |
ALICIA F WALTERS;BRIAN L MUELLER;JAMES A DIRKSEN;PAUL M FEENEY |
分类号 |
B24B57/02;C09K3/14;B24B37/00;B24B37/11;C09G1/02;H01L21/304;H01L21/306;H01L21/3105 |
主分类号 |
B24B57/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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