METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin. Here, before sealing with the resin, a gap between the second semiconductor chip and the wiring board is previously sealed with the adhesive material used when the first and second semiconductor chips are mounted.

主权项

1. A method of manufacturing a semiconductor device comprising the steps of:
(a) providing a wiring board having a first surface, a plurality of bonding leads formed on the first surface, a second surface opposite to the first surface, and a plurality of lands formed on the second surface and electrically connected with the plurality of bonding leads, respectively; (b) arranging a first adhesive material on the first surface of the wiring board; (c) after the step of (b), mounting a first semiconductor chip on the first surface of the wiring board via the first adhesive material such that a first front surface of the first semiconductor chip faces the first surface of the wiring board, and electrically connecting the plurality of bonding leads with a plurality of first front-surface electrodes, respectively, the first semiconductor chip having the first front surface, the plurality of first front-surface electrodes formed on the first front surface, a first back surface opposite to the first front surface, a plurality of first back-surface electrodes formed on the first back surface, and a plurality of through electrodes each formed so as to penetrate from either one of the first front surface and the first back surface toward the other and electrically connecting the plurality of first front-surface electrodes with the plurality of first back-surface electrodes, respectively; (d) after the step of (c), arranging a second adhesive material on the first back surface of the first semiconductor chip and on a surface of the first adhesive material exposed from the first semiconductor chip; (e) after the step of (d), mounting a second semiconductor chip on the first semiconductor chip via the second adhesive material such that a second front surface of the second semiconductor chip faces the first back surface of the first semiconductor chip, and electrically connecting the plurality of first back-surface electrodes with the plurality of second front-surface electrodes, respectively, the second semiconductor chip having the second front surface, the plurality of second front-surface electrodes formed on the second front surface, and a second back surface opposite to the second front surface; and (f) after the step of (e), sealing the first surface of the wiring board, the first semiconductor chip, and the second semiconductor chip with resin, wherein the second semiconductor chip has a planar size larger than a planar size of the first semiconductor chip, and, wherein, after the step of (e) and before the step of (f), a space between the first surface of the wiring board and a portion of the second semiconductor chip not overlapping the first semiconductor chip is filled with the first and second adhesive materials.