| 摘要 |
The present disclosure provides a method of coating a substrate so as to provide a controlled in-plane compositional modulation. The method comprises providing a first target of a first material or material composition, providing a second target (104, 204, 304) of a second material or material composition, different from the first material or material composition; activating the first and second targets (103, 104; 203 204; 303, 304) to release particles by evaporation, sublimation or sputtering; and causing the released particles to impinge onto the substrate (102, 202, 302) such that the substrate is coated. Activation of one of the targets (103, 104; 203 204; 303, 304) includes providing a series of activation pulses, such that pulsed evaporation, sublimation or sputtering of particles is provided, while the other one of the targets (103, 104; 203 204; 303, 304) is substantially passive. The first and second target materials or material compositions present a respective homologous temperature, defined as a ratio (Ts/Tm i) of the substrate temperature (Ts) to the target material melting temperature (Tm i) of the target material (i) having the lowest melting temperature (Tm i), a miscibility (ΔHmix AB), as defined by a mixing enthalpy of the target materials or material compositions, wherein the mixing enthalpy of the materials greater than zero is defined as immiscible and a mixing enthalpy of the materials less than zero is defined as miscible; and a two-dimensional or three-dimensional growth mode. In the method, the homologous temperature is greater than 0.1 and less than 0.5 and the amount of material deposited per pulse train from each target material is greater than 0.1 monolayer and less than 100 monolayers, preferably less than 50 monolayers, less than 10 monolayers or less than 2 monolayers. |
