SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To improve the reliability of electric connection in a semiconductor device in which an electrode of a semiconductor chip makes flip-chip connection with an electrode of a wiring board and an underfill resin is formed therebetween.SOLUTION: A semiconductor device includes: a wiring board 6 including a first electrode 50 having an inverted trapezoid shape cross section; a semiconductor chip 5 including a second electrode 20 having an inverted trapezoid shape cross section; a metal joint material 26 which joins a tip of the first electrode 50 to a tip of the second electrode 20 which faces the tip of the first electrode 50; and an underfill resin 60 which is injected to a space between the wiring board 6 and the semiconductor chip 5 and covers side surfaces of the first electrode 50 and the second electrode 20 and a side surface of the metal joint material 26.