| 发明名称 |
Substrate Design for Semiconductor Packages and Method of Forming Same |
| 摘要 |
An embodiment device package includes a package substrate and a first and a second die bonded to the package substrate. The package substrate includes a build-up portion comprising a first contact pad and a plurality of bump pads. The package substrate further includes an organic core attached to the build-up portion, a through-via electrically connected to the first contact pad and extending through the organic core, a second contact pad on the through-via, a connector on the second contact pad, and a cavity extending through the organic core. The cavity exposes the plurality of bump pads, and the first die is disposed on the cavity and is bonded to the plurality of bump pads. |
| 申请公布号 |
US2015235915(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201414304331 |
申请日期 |
2014.06.13 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liang Yu-Min;Lii Mirng-Ji;Wu Jiun Yi |
| 分类号 |
H01L23/14;H01L23/00;H05K1/03;H01L21/48;H05K1/18;H01L25/065;H01L23/538 |
主分类号 |
H01L23/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device package comprising:
a package substrate comprising:
a build-up portion comprising a first contact pad and a plurality of bump pads at a first surface;an organic core attached to the build-up portion;a through-via extending through the organic core, wherein the through-via is electrically connected to the first contact pad;a second contact pad on the through-via;a connector on the second contact pad; anda cavity extending through the organic core, wherein the cavity exposes the plurality of bump pads; a first die disposed in the cavity, wherein the die is bonded to plurality of bump pads; and a second die bonded to the package substrate. |
| 地址 |
Hsin-Chu TW |
