发明名称 INJECTION MOLDING DIE, RESIN MOLDING, AND OPTICAL EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To prevent an adherence defect of a molding to a fixed side die upon mold opening, and facilitate release of the molding from a movable side die after the mold opening, when a molding having such a structure as to easily cause an adherence defect is molded by an injection molding method.SOLUTION: An injection molding die includes: a movable side die member 50 which has a movable side molding surface 61a forming a cavity 100 between itself and a fixed side molding surface 15a of a fixed side die member 10, and approaches to and separates from the fixed side die member; and an ejector pin 75 appearing and disappearing from an insertion hole 90. On the movable side molding surface, a fine uneven region 110 for holding the molding on the movable side molding surface is provided, when the movable side die member is separated from the fixed side die member after a molten resin has been cooled and solidified, and the fine uneven region is arranged locally on an outer peripheral edge of the insertion hole 90.
申请公布号 JP2015147343(A) 申请公布日期 2015.08.20
申请号 JP20140021243 申请日期 2014.02.06
申请人 RICOH CO LTD 发明人 YAMAGUCHI TOSHIYA;OHASHI TAKAMICHI;OTA YUSUKE
分类号 B29C45/40;B29C45/37;G02B1/04;G02B1/11 主分类号 B29C45/40
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