发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 An apparatus includes a row of substrate transfer devices 3 which can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at right and left sides of the row of the substrate transfer devices along the row, configured to perform processes to the wafer W. The rows of the process modules PM are arranged such that each of the processes can be performed by at least two process modules PM. Thus, when a single process module PM cannot be used, the wafer W can be rapidly transferred to another process module PM which can perform the same process as performed in the corresponding process module. Therefore, even when the single process module PM cannot be used, the processes can be continued to the wafers W without stopping an operation of the apparatus, so that the number of wasted wafers W can be reduced.
申请公布号 US2015235815(A1) 申请公布日期 2015.08.20
申请号 US201314412258 申请日期 2013.04.30
申请人 Tokyo Electron Limited 发明人 Gomi Atsushi;Miyashita Tetsuya;Furukawa Shinji;Maeda Koji;Hara Masamichi;Suzuki Naoyuki;Miki Hiroshi;Hirata Toshiharu
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. A substrate processing apparatus that performs a series of processes to a substrate in a vacuum atmosphere by using multiple process modules in sequence, the substrate processing apparatus comprising: a row of substrate transfer devices each arranged within a transfer chamber in a vacuum atmosphere and each configured to be rotatable horizontally and movable back and forth, the substrate being delivered between the substrate transfer devices adjacent to each other within the transfer chamber; rows of process modules arranged at right and left sides of the row of the substrate transfer devices along the row, each of the process modules performing a process to the substrate; standby decompression chambers arranged at one ends of the respective rows of the process modules; and a control unit configured to control a transfer of the substrate, wherein the multiple process modules include a process module, having a sidewall at a side of the row of the substrate transfer devices protruded toward a space between the adjacent substrate transfer devices, configured to deliver the substrate with respect to any one of the substrate transfer devices at a front side in an inclination direction of the sidewall and a rear side in the inclination direction thereof, in the rows of the process modules, each of the series of the processes is performed in all of at least two process modules, and when one process module of the rows of the process modules is not applicable, the control unit outputs a control signal to continuously process the substrate by using another process module that performs the same process as performed in the one process module.
地址 Tokyo JP