| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity and visibility, and to provide a photosensitive element, a method for forming a resist pattern and a method for manufacturing a printed wiring board using the composition. <P>SOLUTION: The following components are incorporated into a photosensitive resin composition for forming a photo-cured part by irradiating with actinic rays by a direct drawing method. The components are: (A) a binder polymer; (B) a polymerizable compound having at least one ethylenically unsaturated bond; and (C) a photopolymerization initiator comprising an imidazole dimer. The content of each of a sensitizer and a photopolymerization initiator excluding the imidazole dimer is less than 0.1 parts by mass with respect to 100 parts by mass of the total amount of the (A) component and the (B) component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
