Process for preparing a semiconductor structure for mounting

摘要

A process for preparing a semiconductor structure for mounting to a carrier is disclosed. The process involves causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier.

主权项

1. A process for preparing a semiconductor structure for mounting to a carrier, the process comprising:
causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure, wherein;
the void extends into an epitaxial structure in the semiconductor structure,an outer surface of the support material is substantially co-planar with an outer surface of a metal electrode formed on the semiconductor structure,a metal electrode is disposed between the semiconductor structure and the support material in the void,the void comprises at least one sidewall surface and a bottom surface, andat the bottom surface, the metal electrode is in direct contact with the semiconductor structure; and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier.