Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

摘要

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.

主权项

1. A chip stack of semiconductor chips with enhanced cooling comprising:
a first chip with circuitry on a first side; a second chip electrically and mechanically coupled to the first chip by a grid of connectors; and a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes:
a first plurality of magnetized nanofibers that are aligned parallel to mating surfaces of the first chip and the second chip and are aligned perpendicular to nearest first and second sides of the thermal interface material pad, wherein the first and second sides of the thermal interface material pad are opposing sides that extend perpendicular to the mating surfaces;a second plurality of magnetized nanofibers that are aligned parallel to the mating surfaces of the first chip and the second chip and are aligned perpendicular to nearest third and fourth sides of the thermal interface material pad, wherein the third and fourth sides of the thermal interface material pad are opposing sides that extend perpendicular to the mating surfaces and extend perpendicular to the first and second sides; anda third plurality of magnetized nanofibers that are aligned perpendicular to the mating surfaces of the first chip and the second chip.