| 摘要 |
A disclosure of the present invention generally relates to a chip package assembly arranged to be electrically connected to a circuit board including multiple circuit board contact parts. The chip package assembly includes a chip package connecting a first side part and a second side part, and a second side surface comprises multiple circuit board contact parts; multiple first contact parts arranged to be electrically connected; multiple second contact parts arranged to be electrically connected to a remote device through the connector assembly. |
