| 摘要 |
<p>An embodiment provides a package for a millimeter wave band semiconductor. The package for a millimeter wave band semiconductor has metallic body, a circuit board, and a metallic cover. The body has a first non-penetration hole and a second non-penetration hole. The circuit board is arranged on the body. An input signal line and an output signal line are formed on the surface. The cover is arranged on the circuit substrate, and has a first penetration hole and a second penetration hole. The cover is arranged on the circuit board while the first penetration hole is arranged on the non-penetration hole and also the second penetration hole is directly arranged on the second non-penetration hole. And, a first wave guide comprises the first penetration hole and the first non-penetration hole. A second wave guide comprises the second penetration hole and the second non-penetration hole.</p> |
